Solutions
Embedded system solution (C controller)
Semiconductor manufacturing equipment
Porting the control program executed on the personal computer to realize the bonding process
Shorter tact time per chip and increased product production
Overview
Conventionally, a semiconductor bonder has performed a bonding process by executing a control program on a personal computer. By installing a C Controller, bonding processing can be performed while performing complex controls such as camera alignment, bonding settings, and calculation routines. The control program can be directly ported to the C Controller, so there is no need to change the program. Also, since commands can be issued to the motion CPU in 0.88 ms, the tact time per chip can be shortened, and the product production volume of customers increases. A stable supply of parts is also ensured, thus avoiding maintenance risks.
System configuration
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